While striving to advance new processes and new architectures, Intel has taken extra care of new packaging technologies in recent years, which is also a new attempt to develop high-performance, energy-efficient approaches in the face of increasingly difficult processes and architecture improvements. In early 2019, Intel announced a new 3D Foveros stereopackage, the first product codename, Lakefield.
The bottom layer and 10nm computing layer of the 22nm process include a high-performance Sunny Cove, four low-power Tremont sidonties, and a dual-screen version of Microsoft’s Surface Duo and a Samsung Galaxy Book S notebook.
We’ve seen a Core i5-L16G7 in the Lakefield family before, opening up a new naming method with a base frequency of 1.40GHz and an acceleration of an average of 1.75GHz, suspected to be a small core state.
Now, there’s a “Core i5-L15G7” in the GeekBench 5 database, apparently a slightly lower-end model with a reference frequency of 1.38GHz and an average acceleration of 2.95GHz, but not sure which core to match.
In addition, Lakefield has a 32KB first-level instruction cache, a 32KB first-level data cache, and a 1.5MB second-level cache and a 4MB level 3-level cache.
The device with this U is identified as a Microsoft virtual machine, so the big chance is that Duo Surface is being tested and getting closer to being available.
Just don’t know, why Intel has not been published Lakefield’s detailed model, specifications, should be based on OEM needs and individual customization?