AMD’s third-generation Ryzen platform already fully supports PCIe 4.0, from CPU processors to chipsets to GPU graphics, especially for scenarios that require higher-speed solid-state storage. Intel has repeatedly argued that PCIe 4.0 is of little significance for consumer-grade applications, especially gaming applications, but it is only a matter of time before Intel supports PCIe 4.0 under competitive pressure.
Now, the Tenth Generation Desktop Core Comet Lake-S is being released, and the detailed specifications of the Tenth Generation Desktop-class Rocket Lake-S have been dug up, including the native PCIe 4.0.
Data show that the Rocket Lake-S processor will be based on a new core architecture with stronger performance, but it is not clear that the rumored 14nm process will be Willow Cove, which is the same as the mobile version of the 10nm Tiger Lake division at the end of this year. Gpu core graphics card with new Xe graphics architecture is also introduced, supporting HDMI 2.0b standard and higher DDR4 frequencies.
Crucially, of course, it supports 20 PCIe 4.0, four more than PCIe 3.0 on today’s mainstream platforms, just 16 allocated to graphics cards and 4 to SSD SSDs.
AMD’s 3rd Generation Ryzen platform supports up to 44 PCIe 4.0, of which 36 are available externally, including 24 for The Tri-Ray Dragon and 16 for the X570 chipset.
The Rocket Lake-S processor will have a new 500 series chipset, but it still only supports PCIe 3.0, and the communication channel with the 11th generation Core continues with DMI 3.0, but the bandwidth doubles from x4 8GT/s (3.93GB/s) to x8 16GT/s.
It’s unclear how compatible the Rocket Lake-S platform will be, but it’s almost certain that the LGA1200 interface will continue, but it’s not clear whether you’ll continue to support the yet-to-be-released 400-series motherboard, which also provides PCIe 4.0.
Back in the 500 series chipsets, one of the highlights will be the native support for USB 3.2 Gen2x2, or real USB 3.2, with a bandwidth of 20Gbps, but it is not clear how many interfaces are available while continuing to support USB 3.2 Gen2 10Gbps (i.e. USB 3.1), USB 3.2 Gen1 5Gbps (i.e. USB 3.0).
Thunder 3’s renamed Armor version of Thunder 4 will be supported by independent master, and compatible with USB 4, after all, USB4 itself is based on the Thunder 3 protocol completed.
In other respects, the 500 series chipset supports 2.5GbE wired networks, integrates CNVi/Wirels-AX wireless networks, but will remove support for SGX (Software Protection Extension) and no longer support LPC, eMMC, SD 3.0, SDXC and other interfaces.
The release date of the Rocket Lake-S platform is unknown and is expected early next year.