On June 21, Huawei brought a new entry-level TWS headset, FreeBuds, which supports double-click touch and call noise reduction, and continues the design of Huawei FreeBuds in styling, with a hanging design, lightweight and rounded, and a simple and calm design for headphones from golf clubs. 52audio network did a teardown of the Wireless Headset FreeBuds, to see what’s different from the previous FreeBuds.
First, HUAWEI’s FreeBuds FreeBuds wireless headphones out of the box
On the front of the package, the name of the product is: HUAWEI FreeBuds Free Free Premium wireless headset and Huawei’s petal logo, with a rendering of the headset in the middle, a feature icon at the bottom, compatible with Android and iOS system instructions.
The feature icon on the back has one more voice assistant to summon than the front. Below are marked with product packaging tips, battery tips, can not be discarded, recyclable, using soybean ink printing.
Packing list: Quick guide, product warranty card, extra silicone earbuds three pairs, silicone ring pair, headphones, charging cable.
Comes with a USB-A to Micro-USB charging cable.
The charging box top sits, with Huawei’s capital letters printed in dent.
Close-up at the bottom of the charging case, model: CM-H1C, input: 5.2V x 1.1A, output: 5V x 0.11A, SN: 2155030888RL95007065, CMIIT ID: 2018DP8900, Huawei Technologies Co., Ltd., Made in China.
Close-up on the front of the charging case with an indicator light under the opening and closing.
Close-up on the back of the charging case, micro-USB charging port below the hinge, a button to the left of the charging port, press to see the remaining charge of the headset charging case.
A close-up of the open status of the charging case.
Charging seat compartment charging pin and microswitch, microswitch is used to detect whether the headset is in, start charging.
52audio using ChargerLAB POWER-Z KT001 to carry out wired charging tests on HUAWEI’s Huawei FreeBuds wireless headset. The charging current is 0.641A.
Weight of charging case and headset: 52.3g.
Charge box weight: 41.3g.
Headset Weight: 11.2g.
SECOND, HUAWEI’S FREEBUDS WIRELESS HEADSET DISMANTLING
We detach the seat compartment connected to the snap and open the inside of the charging box.
A close-up of the inside of the seat compartment with several magnets for magnetic ally positioning headphones and magnetic suction closed charging cases.
A close-up of the internal component layout of the charging box.
THE LED INDICATORS AND THE HALL ELEMENT SUBPLATE ARE INDIVIDUALLY ATTACHED TO THE PLASTIC FRAME.
A close-up of the three-color LED indicating the charging status and connection status.
Silkscreen HF9152 Hall sensing IC for detecting the opening and closing status of the charging case.
A view of the overall structure inside the charging case.
Battery and motherboard front close-up, the battery is welded on the motherboard by three lines, respectively, the positive and negative poles and the temperature detection line.
Battery close-up with the back of the motherboard.
Rechargeable lithium-ion battery, model 682723, rated capacity: 410mAh, 1.558Wh, nominal voltage: 3.8V, charging limit voltage: 4.35V. Manufacturer: Chongqing Zijian Electronics Co., Ltd.
Lithium polymer battery production date: April 19, 2019.
A close-up of the battery’s protection circuit, with a self-recovering fuse to limit the current, is also connected to the MOS tube in series resistance to reduce the protection current.
A close-up of the microswitch, pressed to detect if the headset is in place.
A close-up of the Motherboard Pogo Pin charging pin.
Tap the key close-up and press to see the amount of power remaining in the headset charging case.
Shanghai Weir WS4612 load switch, supports overcurrent protection and short-circuit protection.
Shanghai Weir WS4612 Details.
Silkscreen cKBEB boost IC.
Silkscreen ZdAYB battery charge and discharge management IC.
Shanghai Weir WS3210C overvoltage protection load switch for input protection.
Shanghai Weir WS3210C Details.
HOLTEK Hetai HT50F32002 32-bit microcontroller.
The HOLTEK microcontroller series is a 32-bit high-performance, low-power microcontroller based on the Arm Cortex-M0 Plus processor core. The Cortex-M0 Plus is a next-generation processor core that combines nested vector interrupt controllers (NCSCs), system beat timers (SysTick Timer), and advanced debugging support. The series of microcontrollers can operate at frequencies up to 20 MHz with the help of flash accelerators for maximum performance. It provides up to 32 KB of embedded Flash memory for program/data storage, and up to 4 KB of embedded SRAM memory for system operation and application application. This series of single-chip implements has a variety of peripherals, such as hardware divider DIV, ADC, I2C, UART, SPI, GPTM, PWM, BFTM, RTC, WDT, SW-DP (Serial Line Debug Port) and more. Several power-saving modes are available to optimize the flexibility of wake-up delay and power consumption, which is a consideration for low-power applications. These features make the series of microcontrollers can be widely used in a variety of applications, such as white goods application control, power monitoring, alarm systems, consumer products, handheld devices, data recording applications, motor controllers and so on.
Let’s look at the headphone symbles section.
The microphone at the bottom of the headset has a hole in the microphone and a filter.
The noise-cancelling microphone on the edge of the headset is open.
A close-up of the infrared sensor’s open window.
A close-up of the headphone charging metal contacts.
A close-up of the headphone relief hole used to balance the air pressure inside and outside.
The headphones are a close-up of the sound hole, covered with a metal mesh cover.
We start disassembling the headset, first separating the top of the headset and the bottom of the headset.
The inside of the headset’s top is at a glance.
The headset positions the magnet close-up and is flanked by charging contacts.
A close-up of the headset speaker unit.
The headset charges a close-up of metal shrapnel, the battery is fixed inside the plastic frame, and the circuit board is hot-melted on the plastic frame.
A close-up of the infrared distance sensor to detect the user’s wear status.
A close-up of the battery’s positive shrapnel.
The bottom of the headset is glued together.
The bottom structure is nested with black rubber ring, which enhances tightness and effectively waterproofs water.
The bottom structure consists of four devices: silicon wheat, black rubber ring, metal dust mesh cover, plastic bottom cover.
Laser k 94153 MEMS call silicon wheat close-up.
The headset uses a button-down lithium battery.
A comparison of the button lithium battery with the one-dollar coin.
Button lithium battery one side close-up, the battery from Zijian electronic, charging limit voltage: 4.2V.
A close-up of the button lithium battery on the other side, model: LIR ZJ1254C, 3.7V, 55mAh, 0.204Wh.
The overall structure of the top of the headset is at a glance.
The FPC of the top structure is connected to the headphone board through a line socket.
We separated the close-up of the headset board.
A close-up of the overall structure on the top of the headset.
Silkscreen AD9R1 IC for distance sensor detection.
Silkscreen 7 L01 IC for magnetic induction, acceleration detection.
Silkscreen MR2 J2C IC for lithium battery protection.
Close-up of the front of the battery board.
Close-up on the back of the battery board.
A close-up of the headset ceramic Bluetooth antenna.
Beneath the blue plastic shell is noise-cancelling silicon wheat.
Laser k 94376MEMS silicon wheat close-up.
St. Bonway SGM40561 high-voltage input single lithium-ion battery charging chip. Up to 30V of input pressure, effectively preventing surge damage. Supports 4.2/4.3/4.35V lithium or polymer lithium battery charging. No external anti-back-tipper diodes required, the St. Bonway SGM40561 offers a space-saving TDFN-2 x 2-8L package, thanks to its small size and wide use in headphones.
St. Bonway SGM40561 Details.
The headset uses bess on BeS Hengxuan BES2000IZ Bluetooth Audio SoC. The BES2000IZ is a fully integrated adaptive dual-mode Bluetooth headset solution with fully integrated, high-performance, low-power features that support the classic Bluetooth V2.1 and BLE 4.2 dual-mode. Built-in high-performance Cortex-M4F core, up to 300MHz, integrated 4MB serial flash memory within the chip for user programming, support for Constant Secret wireless stereo, support for dual microphone noise reduction and echo cancellation, support for multi-band EQ and bass enhancement, support for temperature sensors, support for USB audio playback.
HUAWEI’S FREEBUDS WIRELESS HEADSET DISASSEMBLED THE FAMILY PHOTO.
HUAWEI Huawei FreeBuds has a streamlined design with a simple, compact overall design, and an ergonomic design that makes it easy to wear comfortably and securely. The headphone structure is tight, effectively dust proof and water. The left and right headphones are equipped with double-picksilicon wheat, matching call noise reduction technology, collecting and filtering the sound of the environment, and picking up more clearly, and the internal speakers use composite diaphragm to bring good sound quality performance. The interior is equipped with a BES Hengxuan 2000 Bluetooth audio chip, with full ymme, high performance, low power consumption and so on, so that the headset as a whole has a good experience.