Rambus , a memory patent licensing company, should be happy when Chinese companies enter the memory market. Because in less than half a month, they acquired two large DRAM memory patent granting customers — following Hefei Changxin, GigaDevice signed an agreement with Rambus to obtain the latter’s memory patent grant.
Infographic (from: Changxin official website)
Many DIY players have heard Rambus’s name that the RDRAM memory technology that the P4 era worked with Intel was advanced, but was eventually defeated by DDR memory pushed by AMD and other vendors, and Rambus exited the physical memory space to specialize in memory licensing.
Over the past decade, Intel, AMD, NVIDIA, Qualcomm, Samsung and other companies have been taken down by Rambus, signed a patent licensing agreement. Now Chinese companies also want to enter the memory market, patent licensing is also around the past, as long as the cost is fair and reasonable, money for the market is inevitable, after all, U.S. companies have accumulated in this area for too long.
On April 27, Hefei Changxin signed a memory authorization agreement with Rambus, but did not disclose the specific content of the memory authorization. Today, Rambus has signed a similar agreement with GigaDevice, which has also been granted a memory patent, and has not disclosed the exact amount.
GigaDevice is a leading enterprise of domestic memory chip, but before, mainly in the NOR market, in recent years is also actively entering the memory market, the first two years also signed a memory cooperation agreement with Hefei Changxin, jointly develop 19nm memory, GigaDevice founder Zhu Yiming is also Hefei Changxin chairman.
However, Hefei Changxin previously announced the equity structure, GigaDevice does not have any shares, except for some executives coincide, the two companies are operating independently, otherwise there will be no two Rambus authorization.
According to a previous announcement by GigaDevice, the company raised 3.32 billion yuan at the end of last year, mainly for DRAM memory research and development and industrialization, as soon as 2021 to start mass production.
In the fund-raising announcement, GigaDevice announced the project implementation time and overall schedule of the project, as follows:
In 2020, GigaDevice will launch the first DRAM chip product definition, including market positioning, product specifications and chip design processes.
In 2020, GigaDevice will define the production title of the first chip and will conduct streaming samples in a validated design, repeatedly modified until it is verified by the system.
In 2021, the first chip specimen will be packaged for testing and sent to the system chip vendor for functional certification, which will eventually be verified by the customer.
In 2021, the first chip will be tested for small-scale production, after which it will be successfully tested.
From 2022 to 2025, a new series of chip research and development and mass production will be carried out.