Both Sony and Microsoft have previously made it clear that the new consoles will remain on sale as planned. On Wednesday, digiTimes, amedia source mainly from the supply chain, again backed up the claim. A supply chain source told DigiTimes that delivery to downstream manufacturers next week after the PS5’s AMD chips began “back-end IC packaging and testing.” AMD’s chip production is expected to peak in August, indicating that the PS5 is still expected to be available by the end of 2020.
Image Source: LetsGoDigital
The Sony PS5, like Microsoft’s Xbox Series X, uses a custom processor from AMD, based on a custom Zen 2 CPU architecture, RDNA 2 GPU architecture, and is manufactured using a 7nm process, with slightly different specifications.
The PS5 integrates eight CPU cores and supports synchronous multithreaded, master frequency 3.5GHz, and adjusts autonomously according to the actual situation, while integrating 36 GPU cells, 2304 stream processors, frequency 2.23GHz (same variable), floating-point performance of 10.28 tFlops (10.28 trillion floats per second).
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Sealing operators revealed that this year the United States chip leader ultra-micro (AMD) is indeed strong, in addition to CPU, GPU, server chip market share, the third quarter of the play is one of the second generation of home game console shipping of the customer-made main chip shipment, in addition to TSMC 7 Nami process, the latter section of the sealby by the Taiwan Department of Professional Committee outside the survey of the generation (OSAT) leading the day to control the light and control of the main production base in Taiwan.
In fact, with the hard-core game orientation at odds with the Nintendo Switch series, which focuses on light players, the market is bullish on the launch of the PS5 and the Fourth Season of the Xbox Series X, and represents a head-on showdown between Sony and Microsoft, the two leaders of next-generation home consoles in 2020.
Supply chain operators revealed that ultra-micro is nothing but the two camps of the United States, Japan, the biggest winner, and the Taiwan semiconductor supply chain is the best partner. Both gaming machines have adopted high-customer-based ultra-micro-Zen series CPU and Radeon RDNA GPU series architecture, and are pitched in TSMC’s 7nm process.
PS5 main chip rear section sealing mainly take FC-BGA package, by the sun moonlight investment control and its products to seize the main order, and directly CPU, GPU packaging into a high-customer system-level chip. Sun Moonlight investment control speaking system, always do not make public comments on specific customers, product order status, etc.
Related sealing supply chain operators said, such as the finished product test (FT) end of the various types of test equipment (IC Socket) demand is also very strong, the first half of ultra-micro has been under a large number of production orders, the market is optimistic that such as Yingyi and other operators can provide test ingress.
Familiar with the seal revealed that ultra-micro current product strategy analysis, the third quarter will focus on the main chip of the game console, the beginning of the 4th quarter will determine the first half of 2021 mass production orders, the market estimate will be high-efficiency computing (HPC) related server chips, GPU chips-based.