Intel Xe discrete graphics cards will be coming a long time, but the official will be very appetiteful, from time to time exposure to a bit of a sharp, chief architect Raja Koduri today is a breath out of the chip of three products in a single breath! Raja revealed that he recently visited Xe Labs in Folsom, California, where xe GPUs are being developed and tested, and that the mess and beauty of the lab makes him very nostalgic. Say not much, straight above!
A total of three different Xe GPU chips, the left-hand rectangle Of Raja has been exposed before, then known as “baap of all” (heavenly parent), the length of significantly more than a section 5 dry battery, the width is close to it, visual chip package area of about 3696 square mm, the effective chip core area of 2343 square mm.
In contrast, the 14nm process and 10-core Core i9-10900K package area is only 1406 square millimeters.
It should be a high-performance Xe HP version for data center acceleration cards, with a two-chip package almost 100% inside.
The upper right corner of a smallest area, square, edge length and Xe HP version of the short edge is similar, obviously is a single-chip package version, no accident corresponding to DG1, DG2 desktop discrete graphics card, the only consumer-grade unique display products.
The largest in the lower right corner, of course, is the top-of-the-line version of Xe HPC high-performance computing, with two Xe HP packaged together and four chips inside.
The Ponte Vechhio GPU, which will be released next year for the Aorura supercomputer in the United States, should be it.
This is also in line with previous rumors that the Xe GPU supports a single, two, four-chip combination, memory with 2.8GHz HBM2e, and PCIe 4.0.
Raja also purposely took the Xe HPC version in his hands, further highlighting its size, and described it as “BFP”, big fabulous package, meaning “wonderful giant package.”
Raja also announced the Xe Lab test scenario, which does match its “messy and wonderful” description, and can be seen that the Xe GPU is running on a test platform, either Xe HP or Xe HPC, with a large water-cooled heat.