According to AMD’s roadmap, this year’s 7nm Zen2 architecture is complete, the next generation is the Zen3 architecture, and now the architecture design has been completed, and the stream is also successful, expected to be released in 2020, using the upgraded 7nm plus process. From the previous information, AMD’s Zen3 architecture should be based on Zen2 improvement, similar to Zen upgrade to zen-plus architecture, but AMD Senior Vice President, Data Center and Embedded Business General Manager Forrest Norrod in an interview withmedia made a different statement.
Responding to questions about the performance of the Zen3 architecture IPC used by Milan (Milan, the code name for the third generation EPYC processor), Forrest Norrod noted that the Zen3 architecture is a completely new architectural design, not the same as the second-generation EPYC used by the first generation EPYC upgrade to the Zen2 architecture.
Forrest Norrod says AMD’s Zen2 architecture has provided far more performance improvements than normal – the average IPC has improved by as much as 15 percent because the Zen2 architecture had some ideas that the original Zen architecture should have used, but ultimately failed to use Zen. This resulted in Zen2’s IPC performance exceeding expectations.
As for the Zen3 architecture, Forrest Norrod is confident that it can afford to look forward to a new generation of architecture, in short, he is strongly suggesting that Zen3’s IPC performance is impressive, or at least as good as Zen to Zen2.
In addition, the Milan processor will be more frequent, after all, using the 7nm plus process is an enhanced version, more advanced than the current 7nm Zen2 process.
Responding to processor performance expectations, Forrest Norrod said AMD has strong confidence that each generation of CPU architectures has significant IPC performance improvements.