AMD today unveiled a 7nm Zen 3 processor for launch in the fourth quarter of 2020. Zen 3 offers a higher maximum lift than ever before, up to 19% IPC boost, as well as a new core layout and new cache topology. AMD confirmed that the Zen 4’s 5nm design is also in place. As expected, it seems, AMD’s future will not be “slack.”
AMD throws out a lot of performance comparisons about Zen 3, which they suggest is 2.8 times more efficient than Intel Core i9-10900K. Performance per watt is 2.4 times higher than that of the first generation of Ryzen hardware, and the Zen 3 is 24% higher per watt than the previous generation. AMD claims to have achieved higher load and storage and wider execution capabilities than Zen 2, and more branch forecast bandwidth (“zero bubble” branch prediction).
AMD claims that they have improved “every aspect of the CPU” on the same 7nm node. This means higher frequencies, higher IPC (19% higher than Zen 2), lower top latency, and better nuclear-to-core communication due to the new 8-core complex and new processor layout.
With the Zen 3 core architecture, AMD says they’ve achieved twice as much game memory latency by direct access to L3 caching technology — and each core can address the cache when needed. With this new layout, core and cache communication accelerates game performance — all eight cores get the 32MB L3 cache they want when they need it. Each core can now communicate with the cache on the chip without unmodulation.