Recently, it was reported that Intel’s first 10nm process of the top server platform “Ice Lake-SP”, the release date from the original fourth quarter of this year was postponed to the first quarter of next year. Both it and the published Cooper Lake are part of the third-generation Scalable Power, targeting the one-way/two-way, four-way/eight-way market, with a maximum of 38 core 76 threads, eight-channel DDR4-3200 memory, 64 PCIe 4.0, and thermal design power consumption of up to 270W.
Later, Sapphire Rapids, also based on the 10nm process, has been officially confirmed to be launched later in 2021, with the first silicon chips already lit.
Today,media AdoredTV obtained the detailed parameters of Sapphire Rapids exclusively.
Interestingly, the water meter was quickly checked by Intel and asked to be removed on the grounds of “inaccuracies”, but did not explain where the inaccuracies were, and AdoredTV refused to withdraw the manuscript.
Sapphire Rapids will incorporate SuperFin transistor technology with the latest 10nm, the newly launched Tiger Lake 11th generation mobile version of Core.
The CPU architecture was upgraded to Golden Cove, the same as Alder Lake 12th Generation Desktop Core, which continues to improve IPC performance and restore support for Bfload16 machine learning instructions to enhance AI AI ai AI. Cooper Lake already supports the directive, but ice Lake does not.
The number of cores is up to 56 (112 threads), but it is likely that four cores are also hidden, i.e. there should be a total of 60 cores of 120 threads.
Why are you doing this? Very simple, 10nm s technology in the face of so many cores, the yield of good products is not up for the time being.
Interestingly, Sapphire Rapids will be designed in an MCM multi-chip package that integrates up to four small chips, each with up to 14 cores (plus one that may be hidden), for a total of 56 cores, but it’s unclear if there will be a separate I/O Die like AMD Dragon.
At the same time package integrated HBM2e high bandwidth memory, with 4 small chips up to 4 stacks, each with a maximum capacity of 16GB, a total of up to 64GB, bandwidth up to 1TB/s.
Sapphire Rapids will support PCIe 5.0 bus for the first time, up to 80 channels for high-end models and up to 64 for other models, as well as CXL high-speed interconnect bus protocols.
Another initial support is DDR5 memory, with a frequency of up to 4800MHz, which continues to be eight channels, but the maximum support capacity is not known for the time being, while continuing to support Attenante persistent memory.
DDR5 memory, HBM2e memory can be used in parallel, supporting caching, mixing a variety of modes.
The thermal design consumes up to a staggering 400W, with some models of 300W.
In contrast, amD Dragon’s thermal design consumes up to 280W, Intel’s second- and third-generation scalable to the highest average models up to 250W, and the 56 core of the dual-core package is also 400W, but is now 14nm.
Sapphire Rapids will be launched by the end of 2021 and will be rivaled by AMD’s next-generation Genoa, Zen 4 architecture, which also supports PCIe 5.0, DDR5, and is manufactured using TSMC’s 5nm process.
And the next generation of Dragon “Milan” is expected to be launched later this year or early next year, 7nm craft, Zen 3 architecture, desktop Ryzen 5000 series of the same door master brother.