Shortly after completing a similar-sized financing in July, Huawei again sought the equivalent of $1.5 billion in loan financing, according tomedia reports. The person, who asked not to be named, said Huawei was in contact with international and domestic lenders, with a letter of condolence from Huawei Investment Holdings. The funds raised will be used for general corporate purposes and working capital. Huawei declined to comment on the matter.
In less than a year, Huawei has managed to raise $3.5 billion in the loan market, according to data compiled by Bloomberg.
In July, Huawei received HK$11.7 billion ($1.49 billion) in financing from five Chinese banks to finance the company’s first offshore financing in the loan market without the involvement of an international bank. Huawei also signed a Rmb14bn onshore loan in December 2018.
People familiar with the matter said the new round of financing would be in Hong Kong dollars, dollars or euros, and the loan would be borrowed through Huawei Technologies Cooperatief Ua.