Qualcomm Technology Summit held today in Hawaii, Qualcomm announced the launch of the new Snapdragon 865 mobile platform, as well as the Dragon 765 and 765G 5G chips for mid-range models. Xiaomi 10 will be one of the first products to be equipped with the Qualcomm Snapdragon 865 chip, and OPPO’s flagship phone, released in the first quarter of 2020, will also be equipped with the Snapdragon 865 chip. In addition, Qualcomm announced the launch of the first mobile platform-based module series – The Snapdragon 865 and 765 module platform.
Qualcomm Chairman Amon expects global shipments of 5G smartphones to exceed 1.4 billion units by 2022. He announced that 5G will be expanded to the mainstream by 2020, and that Qualcomm’s 5G mobile platform will provide a higher performance and better experience for the next generation of flagship smartphones.
Qualcomm Senior Vice President and General Manager of Mobile Business Katouzian has launched the Qualcomm 865 mobile platform based on the X55 Modem demodulator, which supports SA and NSA dual-mode 5G networks as well as mmWave. Qualcomm’s Snapdragon 865 is powered by Qualcomm’s fifth-generation ai engine, the AI Engine, which delivers 15 trillion calculations per second. Based on 5G and AI capabilities, the chip can support up to 200 million pixels of cameras.
The newly released Qualcomm 765 and 765G chips integrate Qualcomm’s X52m baseband to support more than 100 million pixels of cameras, mmwave support for NSA/SA dual mode, downlink download speed up to 3.7Gbps, and Qualcomm’s fifth-generation ausiengine Engine.
Qualcomm also launched its first mobile platform-based module series, the Snapdragon 865 and 765 module platforms. Based on an end-to-end strategy, the moduleed platform provides vendors and operators with the tools they need to scale 5G deployments, helping customers reduce development costs and roll out new industrially designed smartphones and IoT terminals more quickly.
Katouzian also announced the launch of a new generation of ultrasonic fingerprint sensor 3D Sonic Max. The 3D Sonic Max supports 17 times the recognition area of the previous generation, enabling fingerprint ingress at the same time with two fingers, improving not only security, but also unlock speed and ease of use.
Lin Bin, vice chairman of Xiaomi Group and general manager of mobile phone department, said in a speech that in the past eight years, 427 million of Xiaomi’s handsets have used chips from Qualcomm. Lin bin also announced that Xiaomi 10 will be one of the first mobile phones to support the Qualcomm Snapdragon 865 platform, in addition to Xiaomi will also launch a 5G mobile phone based on the Qualcomm 765 chip.
Wu Qiang, Vice President and President of Global Sales, announced that in the first quarter of 2020, OPPO will launch its flagship product with the Snapdragon 865 chip. The OPPO Reno 3, released in December, is powered by a 765G chip, a 5G phone that supports the SA/NSA dual-mode model.