On the second day of Qualcomm’s annual SnapDragon technology summit in Hawaii, Qualcomm detailed the technical parameters for the SnapSnapdragon 865 platform just released yesterday. Key features of the SnapDragon865 include: external X55 baseband chip-to-eat global network ingest, fifth-generation AI engine, 1-billion-pixel high-speed ISP, and end-travel-level experience games.
Sina Technology Zheng Junfrom from the United States
After the keynote, Qualcomm Senior Vice President and 4G/5G General Manager Durga Malladi, Senior Vice President of Product Management Keith Kressin and Vice President of Product Management Kedar Kondap were interviewed by the Chinese media group to clarify and explain the adoption of the external baseband for the SnapDragon865 platform. (As the three people take turns speaking, the following are replaced by Qualcomm executives.) )
In the interest of the outside world SnapDragon865 using the external X55 baseband, rather than the integrated baseband scheme, Qualcomm executives confirmed that the SnapDragon865 can only use the X55 baseband, not with other basebands, the development of the clear use of a separate approach.
Why the external scheme? Because the 800 series started with an external baseband, the separation was originally the solution. The X55 is already the best baseband in the industry and has been adopted by many users. The use of external solutions allows OEMs to quickly commercial snapSnapdragon 865 and X55, the product will be on the market as soon as possible.
Qualcomm executives said it was clear that the 865 would use the external scheme so that the 5G scheme could be rolled out more quickly and the results of the x55 could be fully utilized. Bring the product to market. In this way, there is more energy resources, can be launched at the same time integrated baseband chip 765/765 G platform, so that 5G into the mid-market, which is also the needs of OEMs.
The main purpose of integrating the baseband chip is to save space, reduce power consumption and save costs. But the Split Scheme of SnapDragon865 and X55 allows OEMs to save costs and have no impact on power consumption, and can be implemented in a modular manner if OEMs need space.
The SnapSnapdragon 865’s external solution has no disadvantages and is not an outdated process. Technical performance is the most important, and of course integration solutions are possible in the future. Qualcomm executives say that if you question it, we can compare each performance by feature, and we’re industry-leading. Other friends who use integration solutions actually make trade-offs and sacrifices in performance.
The SnapSnapdragon 865 platform continues to use TSMC, while the 765/765G platform uses Samsung foundry. Asked about the issue, Qualcomm executives explained that the choice of a foundry would depend not only on the technical parameters of the chip, but also on commercial considerations, including supply capacity and diversification. Samsung and TSMC are leading chip makers, and the choice of different foundrys, respectively, can ensure that both 865 and 765 are shipped on a large scale, so that OEM customers can get adequate supply.
Asked why the SnapSnapdragon 865 doesn’t use TSMC’s latest 5nm technology, Qualcomm executives said the SnapDragon865 platform needs a large-scale shipment of TSMC and the most efficient and stable production process. Of course, Qualcomm will not always use 7nm technology, and will certainly use the latest technology in the future.
The SnapDragon865 platform does not use TSMC’s latest EUV UV lithography technology. Qualcomm executives explained that EUV UV light was an innovation in manufacturing, but that the finished product was not much different for end users. Only one manufacturer now uses TSMC’s EUV, but the shipment is not very large. Qualcomm needs stable production to ship to many end users in large quantities. However, it does not rule out the future use of EUV lithography technology.
Why does Qualcomm not have a self-developed CPU architecture? Qualcomm executives say ARM’s CPU architecture is doing very well and that if Qualcomm continues to invest heavily in research and development in this area, it may not make sense in terms of return on investment; Qualcomm and ARM have been working very closely together, using ARM’s architecture to allow Qualcomm to focus more resources on improving other performance.
The SnapSnapdragon 865 platform also includes an upgraded 3D ultrasound fingerprint. When it comes to why only Samsung uses the technology, Qualcomm executives say the use of ultrasonic fingerprints requires close cooperation with display vendors, and Samsung has both advantages. However, Qualcomm is also working with display manufacturers such as Beijing Oriental to continue to promote the technology and bring the new technology to the ground.
They stress that ultrasonic fingerprints are more secure and accurate than optical fingerprinting, and that the technical advantages are obvious. The 3D ultrasound fingerprint son on the SnapSnapdragon 865 platform expands the fingerprint identification area and adds dual fingerprint recognition. Some customers may feel that the current 2D fingerprints are enough, but Qualcomm must continue to introduce more advanced unlock technology.