Qualcomm’s SnapDragon 765 series processors released this year use Samsung’s 7nm EUV, which means Samsung’s 7nm process can also be mass-produced, which is also an opportunity for other semiconductor companies, as TSMC’s 7nm capacity is now being snapped up. AMD’s Ryzen 3000 high-end model also encountered a shortage of problems, then AMD will use Samsung contract?
AMD used TSMC’s 7nm and Globalfoundries (GF) 14/12nm process on this year’s Ryzen 3000 and EPYC 7002 series processors, which are responsible for the CPU core of contract AMD and the chipset for the contract AMD processor.
In fact, GF initially also had plans to participate in AMD’s 7nm CPU contract, but last August they announced the end of 14/12nm process contract, in theory AMD also has more 7nm contract requirements, although TSMC process than GF reliable, but one more is always better.
On the question of whether Samsung can participate in AMD’s chip contract, AMD Senior Vice President Ruth Cotter recently took a stand in an interview with analysts, the answer is also very simple, that is, AMD’s current size of business decided that there is no need to work with Samsung. TSMC and GF are sufficient to meet AMD’s current and future contract ingress requirements. Over time, AMD may consider different build-plant combinations, but so far GF and TSMC foundry have been able to fully meet demand.
It seems that AMD did not say dead, in fact, can not easily change the factory is also for a reason, because AMD and GF WSA wafer procurement agreement is a five-year signing, only this year signed a new contract agreement, before 2024 to ensure a certain amount of procurement, during which AMD is unlikely to replace the foundry.