We are in an era of information explosion, and information generation and dissemination can not be separated from the basic hardware carrier, according to the market research organization IC Insights new research report, 2020 the world will have 10 new 12-inch fab into the production stage, the global wafer production capacity will be added 17.9 million pieces of 8 inch wafer, In 2021, the new production capacity will reach a record high of 20.8 million pieces of 8 inch wafers. The new production capacity is mainly from the Korean big factory Samsung andSK Hynix, as well as the Yangtze River storage, Wuhan New Core, Huahong Hongli and other mainland China’s semiconductor plants.
The report notes that since 2000, the semiconductor industry has increased wafer shipments by increasing the amount of wafers to be cast, and that the use of process microscokers to make more wafers per wafer contribution is modest. In fact, in the 20 years from 2000 to 2019, the average annual growth rate of each wafer cut out of a good wafer was only 0.9%, but the average annual growth rate of wafers increased by increasing wafer spouts was 6.5%. Overall, 86% of the new wafers added each year from 2000 to 2019 came from an increase in wafer slots, and only 14% came from the process of micro-cutting each wafer to cut out more wafers.
The semiconductor market in 2017-2018 there have been storage chips and some logic chips out of stock, DRAM and NAND Flash prices rose, memory chip plants have expanded capacity to respond to strong demand, wafer foundry and IDM plant also have plans to expand capacity. However, international economic uncertainty has led to a cooling of semiconductor market demand, memory chip prices have been falling in 2019, storage chip plants have also suspended capacity expansion plans, wafer foundry and IDM plant capacity utilization rate is also under repair. According to IC Insights, the average global production capacity utilization rate for fabs will reach 94% in 2018, but will fall to 86% in 2019.
But for semiconductor plants, the expansion of capacity has not been cancelled but delayed, with the largest expansion coming from memory chip plants. Due to the recent return to market temperature of DRAM and NAND Flash, the storage chip plant will restart its capacity expansion program, and the new global wafer production capacity will increase significantly in 2020 and 2021, which is equivalent to entering a period of rapid expansion.
According to industry sources, for example, Samsung to actively expand 3D NAND production capacity, its second phase of the wafer plant in Xi’an has been completed, is expected to start mass production in the first quarter of 2020, Samsung’s P2 plant in Pyeongtaek, South Korea, has also been built, is expected to enter mass production in the second half of 2020.