Whether it is thin or game book, the current equipped processor and graphics card are more and more strong, unfortunately, the bottleneck to limit notebook play is mainly cooling, overheating will bring down the frequency, noise and other issues, seriously affect the experience. Intel is developing a new thermal solution based on the average heat plate and graphite fins for the current notebook’s thermal intake, which is expected to be used in Athena notebook.
The notebook market, which accounts for nearly 70 percent of Intel’s revenue in its PC business, is important to Intel, whose Athena plan is to reshape the notebook experience and keep manufacturers close together in an Intel-centric ecosystem.
Previously, Intel made detailed specifications for notebook performance, response time, network connectivity, battery life and even appearance, and now it’s focused on notebook cooling, and is developing a new cooling solution that claims to improve thermal performance by 25-30%.
Sources from the source said that compared to the current use of hot tube s fans, Intel co-manufacturers developed a thermal module using the average heat plate, and using graphite sheet fixed behind the screen area.
In addition, the notebook’s hinges have to be redesigned to allow graphite sheets to pass heat through the hinges – a scheme that sounds interesting, presumably by making the back of the notebook’s screen (i.e. the A side) a new cooling area, rather than relying on the air outlet on the left and right of the fuselage and the rear, as is now the notebook.
Intel’s new cooling solution can be used to make fanless notebooks, and it can also reduce the thickness of the notebook, as well as for foldable notebooks in addition to traditional notebooks.
The technology has attracted interest from several notebook manufacturers, and products are expected to be on display at ceiss in 2020, the sources said.