Intel plans to announce advanced notebook cooling solutionat at CES 2020

To create a thinner, quieter laptop, Intel isn’t just working on chip design. Recently,media reported that Intel may announce advanced thermal solutions at CES 2020. The source said: With the addition of materials such as vacuum cavity average heat plate and graphite, it is expected to reduce the operating temperature of the laptop by 30%. Specifically, the new component will replace the traditional cooling module that fills the keyboard and enclosure, which transfers heat from the area to the back of the screen for better cooling.

Intel plans to announce advanced notebook cooling solutionat at CES 2020

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This cooling solution is said to be part of the Intel Project Athena certification program, helping manufacturers reduce the overall thickness of their systems and even introduce fanless designs. For consumers, this is undoubtedly a huge bonus.

In recent years, similar cooling schemes have been widely used in many gaming laptops. In the implementation process, the new scheme is also more flexible than the heat pipe module.

Intel plans to announce advanced notebook cooling solutionat at CES 2020

It should be noted that laptop manufacturers will have to redesign their hinge systems so that graphite sheets can efficiently conduct heat.

At the upcoming CES show (January 7-10, 2020 in Las Vegas), there will be a number of partners showcasing this new Intel-led design.

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