How will the CPU develop in the future? Intel executives said in an interview that they would use EMIB packaging technology for desktop processors, so that future Core processors could simultaneously integrate chips from processes such as 7/10/14nm. As a proponent and staunchest proponent of Moore’s Law, Intel has previously said it will resume the previous two-year process upgrade cycle after 10nm nodes and continue to give Moore’s Law its life.
But then again, the meaning of Moore’s Law has changed, and Intel will continue to drive high-density integration of processors in the future through advanced processes, such as EMIB technology.
Aandtech previously spoke to Ramune Nagisetty, Intel’s Director of Process and Product Integration, at the IEDM conference, about Intel’s progress and direction of advanced packaging technology, especially EMIB technology.
Ramune Nagisetty said Intel had shipped 2 million EMIB-based chips, and it appeared that Intel had only mentioned at the end of November that they had shipped 1 million EMIB package chips.
Intel currently uses EMIB technology mainly Lakefield chip, the quirky 1 plus 4 core architecture, mainly used in low-power mobile devices, Microsoft’s future Surface products will use this chip.
Ramune Nagisetty said in an interview that EMIB would be used in future for large-scale shipments, including desktop processors, but she didn’t mention the details and we don’t know which generation of Core CPUs Intel intelly intends to use EMIB technology.
What is certain, however, is that Intel’s 10nm, 14nm or even 22nm processes will not be phased out after 7nm in 2021, and can be combined for future desktop processors on demand.
EMIB explained in detail, simply put emiB is a 2.5D packaging technology, can allow different processes, different architectures of chip geometry together, the advantage is flexible matching, after all, not all chips need the most state-of-the-art process.
The core idea of EMIB technology is also chiplets small chip design, similar to AMD’s 7nm Zen2 processor, but technically different, AMD’s modular chip package is not so advanced, the two goals are similar.
EMIB is known as Embeded Multi-Die Interconnect Bridge, which means “embedded multi-naked interconnect bridge.”
The term may feel strange, but the most typical product must have been made clear that Kaby Lake-G, Intel’s first integrated AMD Vega GPU graphics core, was encapsulated in separate bare sheets with HBM sepsis with EMIB integration.
EMIB is a high-density 2D flat package technology that flexibly combines chip IPs of different types and processes, similar to a loose SoC.
In this packaging method, play a central role, connecting different pieces of bare metal is the silicon intermediary layer (Interposer), through which it can flexibly mix and match a variety of bare chips, such as CPU, GPU, HBM sepsis, etc. , for the size of the bare chip is not strict requirements, and the overall manufacturing is simple, packaging process is also standard, The cost is very economical.
However, it also has some shortcomings, such as the mediation layer added additional connection steps, easy to affect performance, and the size of the mediation layer is limited, so it is more suitable for some integrated bare film is not much, the interconnection requirements are not too high products.