Samsung’s 7nm process is a year behind TSMC due to its aggressive use of the EUV process in the 7nm node, and is currently produced using the Samsung 7nm EUV process using Qualcomm’s SnapDragon 765 series chips. Since then, Samsung has accelerated the progress of the new process, the 6nm process has also produced goods, this year will complete the development of the 3nm GAE process.
After entering the 10nm node, semiconductor process manufacturing is becoming more and more difficult, but the demand is still rising, which led Tossu, Samsung to improve the different processes to introduce the new process, and Samsung’s 6nm process is actually an improved version of the 7nm process, based on the 7nm EUV application of Samsung’s unique Smart Smart Scaling solutions greatly reduce the chip area and bring ultra-low power consumption.
Executives in Samsung’s fab manufacturing business have confirmed the 6nm process’s chip shipments for delivery to customers in North America, where it is not yet certain which chip it will be, although Samsung officials did not mention specific information, the sources said.
If 6nm successful mass production, then Samsung hands now into the real production stage of the process has 7nm EUV, 6nm LPP two kinds, can better grab the market from TSMC.
After 6nm, Samsung also hopes to launch the 5nm EUV process this year, TSMC is also scheduled to produce 5nm EUV process in the first half of this year, so samsung finally catch up with TSMC’s process progress, but Samsung still did not announce who 5nm customers are.
Samsung’s real hope of surpassing TSMC’s process is 3nm, they are the first official to use the new GAA transistor, in the 3nm node will replace the FinFET transistor with GAA surround gate transistor, Samsung hopes to mass production of 3nm process in 2021, and the first half of this year to complete the 3nm process development.