Intel 10nm? Tiger Lake wafer first exposure: 20% increase in core area

Intel unveiled some of the details of the next-generation mobile platform Tiger Lake (or will be named 11th Generation Core) at the CES 2020, using a 10nm plus process to integrate the new Willow Cove CPU core, Xe LP GPU core, and increase IPC performance by more than double digits. At the same time greatly enhance aI performance. In an internal display after the meeting, Intel presented Tiger Lake’s wafers for the first time.

Intel 10nm? Tiger Lake wafer first exposure: 20% increase in core area

In fact, although Intel officially says Tiger Lake uses an enhanced version of 10nm plus, it will be a third generation (10nm? )

Prior to that, cannon Lake, the first generation of 10nm processes, was born dead because it was completely unqualified, leaving only a dual-core, non-nuclear i3-8121U. The current Ice Lake is already used by the second generation (10nm plus), the frequency is still not off, up to 4.1GHz.

Ice Lake and Tiger Lake will only appear on u/Y series low-power mobile platforms, as well as servers, when the process is not up to standard.

Intel 10nm? Tiger Lake wafer first exposure: 20% increase in core area

Tiger Lake’s core can be clearly seen from the wafer, including four CPU cores (top left and below), GPU core (right), etc., which measures the core area by 13.64 x 10.71 x 146.10 mm2, compared to 11.44 x The Ice Lake, 10.71, was increased by about 20% by 122.52 square millimeters, with the width constant and the length increasing by 2.2 mm.

The increase was mainly due to GPU core display, architecture upgrades, and the number of execution units increased from 64 to 96.

Intel 10nm? Tiger Lake wafer first exposure: 20% increase in core area

Intel 10nm? Tiger Lake wafer first exposure: 20% increase in core area

Intel 10nm? Tiger Lake wafer first exposure: 20% increase in core area

Intel 10nm? Tiger Lake wafer first exposure: 20% increase in core area

Mini-most mini-board in Intel history with Tiger Lake

Intel 10nm? Tiger Lake wafer first exposure: 20% increase in core area