Semiconductor devices are widely used in a wide range of applications, from smartphones to automobiles, and semiconductor lithographers are essential in their manufacturing. Did you know that it is 50 years since Japan’s first semiconductor lithography machine went on sale? Today, Canon China announced the 50th anniversary of the launch of Canon’s first semiconductor photolithography pPC-1 in Japan. The Canon PPC-1 was launched in 1970, and with the rapid development of digital technology, Canon’s semiconductor lithography machine is also being upgraded.
The first Japanese semiconductor photolithography machine PPC-1
It is reported that the history of Canon lithography machine began with the high application of camera lens technology. Using the technology accumulated in camera lens development in the mid-1960s, Canon developed high-resolution lenses for photomask manufacturing.
Since then, in order to further expand the scope of business, Canon began the development of semiconductor lithography machine, and in 1970 successfully launched Japan’s first semiconductor lithographY PPC-1, officially entered the field of semiconductor lithography machine.
Canon’s FPA-141F lithograph, launched in 1975, was the world’s first exposure of less than 1 micron (000th s10000th sm), a technology that was included in the Industrial Technology History Information Center of the National Science Museum of Japan in 2010 as an “important scientific and technological historical data (future technological heritage).”
Canon’s current line-up of lithographers includes i-wire lithography machines and KrF lithography product lines. Among them, i-line photolithography machine refers to the use of i-line (mercury lamp wavelength 365nm) light source of semiconductor lithography machine. KrF lithography is a semiconductor photolithography machine that uses a laser produced by a laser with a wavelength of 248nm, from a kr (Kr) gas and a fluorine (F) gas.
Canon said it will continue to expand its product lineup and optional features for semiconductor lithographers to support wafers of all sizes and materials, as well as next-generation packaging processes.
In addition, in the cutting-edge field to meet the needfor further micro-refining of circuit patterns, Canon is also working to promote the development of nano-printing semiconductor manufacturing equipment, 7, and make it available for large-scale production.
What is a semiconductor lithograph?
Semiconductor photolithography machine in the semiconductor device manufacturing process, assume the role of “exposure.” Semiconductor devices are made by exposing fine circuit patterns on semiconductor substrates called wafers. The role of the semiconductor photolithography machine device is to shrink the circuit pattern drawn on the mask plate through a projection lens and then expose the pattern to the wafer.
The wafer moves in turn on the wafer table, and the circuit pattern is exposed repeatedly on a wafer. Because circuits are made of ultra-fine patterns from micron to nanoscale that are stacked in multiple layers, semiconductor photolithography machines also require ultra-high-precision technology to meet performance at the micron to nanounit levels.
The following are semiconductor device manufacturing processes:
1, make a mask version (original)
Design circuits that determine the function and performance of semiconductor chips. Circuit patterns are drawn on dozens of glass plates.
2, prepare the wafer
Prepare the disc-shaped wafer spree on the basis of the semiconductor device. After heating, an oxide film is formed on the surface and then coated with photoresist (photosensitive agent).
3. Draw a circuit pattern on the wafer
(1) Light on the mask plate, the circuit pattern exposed on the wafer. Light shrinks through the lens, and a thinner line can be drawn. The smaller the line width of the circuit, the more semiconductor components can be integrated on a semiconductor device, resulting in high-performance, versatile semiconductor devices. (Using lithography machine)
(The schematic of exposure)
After the light to the part of the light resistance changes. Use the developer fluid to remove the exposure part.
(2) The oxide film outside the photoresist covering part is removed by reaction with the gas.
(3) After removing unwanted photoresists, the transistor works effectively by injecting ions on the exposed wafer, thereby manufacturing the semiconductor component.
(4) After covering the entire wafer with an insulating film, level the surface to ensure that there are no bumps. Then apply the light resistance to prepare for the exposure of the next layer of circuit pattern.
Repeat the process of (1) to (4) to form multiple layers on the surface of the wafer, and then connect by wiring.
4. Cut the semiconductor chip from the wafer
5, the chip glued to the frame, connected to the wire inspection project after the semiconductor device production completed