Intel’s return to the independent graphics market can be said to be a great expectation, but the progress is not very fast, different product lines are also fast and slow. Intel has now announced that the DG1 for the Xe LP architecture for mobile notebooks will be available later this year, as well as Ponte Vecchio for high-performance computing, Xe HPC architecture, followed by a game-oriented, Xe HP architecture that has yet to appear, or DG2.
In fact, last year, there was a test drive leaked out, can see the DG1, DG2 figure:
iDG1LPDEV ” Intel (R) UHD Graphics, Gen12 LP DG1″ “gfx-driver-ci-master-2624”
iDG2HP512 ” Intel (R) UHD Graphics, Gen12 HP DG2″ “gfx-driver-ci-master-2624”
iDG2HP256 ” Intel (R) UHD Graphics, Gen12 HP DG2″ “gfx-driver-ci-master-2624”
iDG2HP128 ” Intel (R) UHD Graphics, Gen12 HP DG2″ “gfx-driver-ci-master-2624”
As such, DG1 and DG2 are based on the 12th generation graphics architecture (the same is the same as the integration in Tiger Lake), and DG2 is divided into different versions, with 512, 256, and 128 execution units, respectively.
According to reliable industry sources, Intel DG2 discrete graphics cards will not be released until 2022, and are contracted using The ClTech 7nm process.
Intel did say last year that its 7nm process would debut in 2021 with xe discrete graphics, but apparently referring to the high-performance computing Ponte Vecchio.
It is not clear why Intel DG2 graphics card to TSMC, after all, since the home 7nm can manufacture high-performance computing GPU, performance is certainly not a problem, it has to be attributed to cost, capacity and other concerns.
In addition, Intel chose to be TSMC standard 7nm, rather than the second generation of 7nm plus EUV, certainly also to take into account the cost, capacity, after all, TSMC’s large customers have more.
According to the previously announced official road map, after the birth of the Intel 7nm process, in 2022 and 2023 there will be an upgraded version of the 7nm plus, 7nm plus.
Intel claims that the 7nm will introduce EUV ultra-UV lithography technology, doubling the density of 10nm transistors, reducing design rules to a quarter, and supporting the next generation of Foveros, EMIB packaging technology.