While consumers don’t want smartphones to become hot during use, few people in real life are willing to introduce a thick cooling scheme for mobile devices, such as adding miniature fans. One day, however, new materials that absorb and transfer heat release sepsis are expected to dramatically change the mobile phone experience. Previously, researchers have shown so-called system phase change materials. As the temperature rises, they absorb heat and become more like liquids. When cooled, the material releases the heat it stores and restores it to solids.
MIL-101 (Cr) coated aluminum sheet (from: Shanghai Jiaotong University, via New Atlas)
Although the use of phase-change materials is a clever way to dissipate heat, scientists at Shanghai Jiaotong University believe that the total energy exchange in the process of solid-liquid conversion is not worth mentioning.
The researchers decided to look at so-called metal organic skeleton (MOF) compounds, especially a product called MIL-101 (Cr).
When the temperature is low, it specializes in absorbing water vapor from the surrounding air species. At higher temperatures, heat is released in the form of steam. This characteristic makes the MOC compound ideal for cooling material.
Led by Professor Zhuru Wang, the researchers started with three 16-square-centimeter (2.5-square-inch) aluminum plates covering the MIL-101 (Cr) coating.
The coating thickness on each piece of aluminum varies, from the thinnest 198 microns to the thickest 516 microns, which are then placed on the heating platform. It was found that the coating had a great effect on the speed of heating up to 60 degrees C (140 degrees F).
Infrared thermal imaging comparison (pictured from: Chenxi Wang)
A sheet of uncoated sheet slabs that can reach 60C in just 5.2 minutes. Thin sheets with thinner and thicker coatings can be extended from 11.7 to 19.35 minutes.
In a more practical test of the technology, scientists applied the MIL-101 (Cr) coating to the radiator on a microcomputer.
Compared to uncoated heat sinks, the coating scheme reduces the overall operating temperature by 7 degrees C under heavy load for 15 minutes.
Professor Wang and his colleagues are currently working to improve the thermal conductivity of the material. Because once completely dry, the coating can hinder the cooling effect.
In addition, they want to find ways to reduce costs, as current MOF materials are still quite expensive. Details of the study have been published in the recently published journal Joule. Originally published as:
A Thermal Management For Electronic Devices, On Moisture Action-Desorption Processes