Western Digital today officially announced the next generation of flash memory technology BiCS5, which Western Digital developed in conjunction with Kioxia (formerly Toshiba Storage). The 112-tier stack, based on the original 96-tier stack BiCS4, has two types of TLC and QLC flash, with a maximum core density of 1.33Tb, and is currently the highest storage density product.
(Image via AnandTech)
Dr. Steve Paak, Senior Vice President of Technology and Manufacturing, Western Digital Memory Chip, says that as we move into the next decade, a new type of 3D flash memory is critical to continuing to meet the growing demand for data capacity and rates. BiCS5’s successful development reflects The Western Digital’s leadership in flash memory technology and the strong execution of the roadmap.
BiCS5 Flash is the most advanced and dense3D NAND flash memory in Western Digital today, significantly increasing the horizontal storage density of memory chips by using second-generation multi-layer storage holes, improved processes, and other 3D NANDg capabilities, plus a 112-layer vertical stack. This resulted in a significant improvement in BiCS5 and BiCS4 flash technology from the previous 96-tier stack, with a 40% increase in storage capacity and a 50% improvement in IO performance, while optimizing costs.
Western Digital BiCS5 Flash is mainly TLC and QLC Flash, initially starting with 512Gb core TLC mass production, followed by more capacity options, including the highest density of 1.33Tb QLC flash, is expected to start commercial production in the second half of 2020. The main production plant is the fab in Mie Prefecture in Japan and the north of Iwate Prefecture listed fab.