Recently, a netizen discovered intel Core i9-10900K in its 3DMark database and found that the upcoming CPU has a base frequency of 3.7GHz and has a frequency of up to 5.1GHz. As a consumer flagship, the chip is expected to suppress the challenge of AMD Ryzen, but its thermal design power consumption (TDP) remains a mystery.
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Earlier today, Twitter users @_rogame shared a screenshot of 3DMark. The 14nm Comet Lake chip is said to encapsulate 10 core / 20 threads, supplemented by a 20MB cache.
According to Tom’s Hardware, the previously compatible LGA 115x heatsink will still be available on the new LGA 1200 motherboard because both have the same mounting hole size.
In other words, as long as the performance of the old radiator is strong enough, it can still suppress the huge heat emitted by the Core i9-10900K.
Unfortunately, valuable thermal design power (TDP) information is not available in the 3DMark database. Given that it’s only a small upgrade to the old architecture, many worry that the i9-10900K is hard to hold on to.
On the other hand, the i9-10900K is rumored to be equipped with Intel’s Turbo Boost Max Technology 3.0 and Thermal Velocity Boost technology, so it can soar up to 5.3GHz.
Finally, we expect to see the motherboard with the latest Z490 chipset in May this year.