Rumours about the iPhone SE2 have been particularly great in recent times, perhaps related to its imminent release. Earlier today, Tianfeng International analyst Guo Mingyu reported again that the iPhone SE2 will ship at least 20 million units by 2020 (up to 30 million units in an optimistic scenario).
The report also notes that Apple will begin selling iPhone models (including the iPhone 7 series and earlier) with the Any-Layer HDI motherboard in the third quarter of 2019, which will feature a sLP motherboard with a higher unit price than Any-layer HDI.
According to previous reports given by Guo Mingyi, the iPhone SE2 could be shipped by 30 million units in 2020, and the iPhone 6 and 6S series users will be its main user base.
It is reported that the iPhone SE2 will have dark gray, white and red color scheme. The iPhone SE2 will feature the same A13 chip as the iPhone 11, and 3GB of LPDDR4X memory, similar in design to the iPhone 8, which is 4.7 inches in size and costs from $399, or about 2,800 yuan.
To cut costs, the iPhone SE2 may not have a better camera than the one in the iPhone 11 series. It was previously reported that the iPhone SE2 would retain the Home key instead of a Face ID. In addition, the iPhone SE2 will not be equipped with 3D Touch.