Intel Alder Lake-S Desktop CPU: 10nm Process, LGA1700 Interface

Intel’s product lines and roadmaps have been a bit messy over the years, and they’re constantly changing, and they’re often confusing in the face of all kinds of exposures. Now, someone has unearthed a new code name for “Alder Lake-S” from Intel’s official profile, apparently Intel’s desktop-level processor by naming.

Intel Alder Lake-S Desktop CPU: 10nm Process, LGA1700 Interface

Soon, Intel will release the 10th generation of desktop-grade Comet Lake-S, which is still a 14nm process old architecture, with up to 10 core 20 threads, replacing the LGA1200 new interface with a 400-series new motherboard. These are all familiar.

The next generation will be Rocket Lake-S, expected to be released by the end of this year or early next year, said to be a 14nm process of old architecture, but returned to up to 8 core 16 threads, similar to today’s nine generations, the interface will certainly continue the LGA1200, but there will be a new 500 series of motherboard.

Intel Alder Lake-S Desktop CPU: 10nm Process, LGA1700 Interface

Alder Lake-S is, of course, the next generation, and the details are unknown, and the following are hearsay.

It could finally be used by the long-awaited 10nm in late 2021 or early 2022, and it’s the second generation of 10nm, just like the mobile version of the 10nm Tiger Lake later this year.

If that’s the case, 14nm will be used in Intel desktop products for up to six-and-a-half years, absolutely super-old.

We used to think Intel would give up 10nm on the table and wait 7nm, but the authorities have denied it and have not given any specifics, and now it’s finally settled.

The bad news, though, is that while upgrading the process, the Alder Lake-S is changing the interface, this time with the LGA1700, adding 500 pins in one fell.

Intel Alder Lake-S Desktop CPU: 10nm Process, LGA1700 Interface

Intel Alder Lake-S Desktop CPU: 10nm Process, LGA1700 Interface

This means that It is highly likely that Alder Lake-S will support both DDR5 memory and even PCIe 4.0/5.0, after all, in almost two years’ time when they are ready to enter the market, and AMD’s next-generation architecture Zen 4 is expected to support DDR5.

As the interface changes, the package size changes significantly. The current LGA1151 and the next generation of LGA1200, the size is 42.5 x 42.5 mm, standard square, LGA1700 will become rectangular, specifically 45 x 37.5 mm.

It may also mean that it is possible to wrap two Dies inside the Alder Lake-S to get more cores to compete with AMD Ryzen, which has now brought the 16 cores to the mainstream market.

What will Alder Lake-S look like, and continue to see, the only certainty is that Intel’s pressures over the years will continue to be intense and the product line will continue to adjust.