Qualcomm tonight unveiled its third-generation 5G baseband chip, the SnapDragonX50, using a 5nm process. Qualcomm is tight-lipped about the source of the 5nm process’s foundry, butmedia reported that the SnapDragonX60 debuted Samsung’s 5nm process. The SnapDragonX60 5G baseband is the first to be manufactured with a new 5nm process, more energy efficient and smaller in size, enhancing carrier aggregation compared to the previous SnapDragonX55, and flexibly deployed by operators through a broad spectrum portfolio.
Given that the SnapDragonX60 base belt won’t be shipped until 2021, the first 5nm chip to be launched is not unexpected or Huawei’s Kirin 1020 and Apple’s A14, TSMC still has an advantage in progress.
It is not yet clear whether it is Samsung’s exclusive contract or Samsung, TSMC, respectively, part of the contract, but This time Samsung in the 5nm node finally preempted, at least 5nm chip debut of the honor.
But for Samsung, the 5nm debut is really too important, Samsung announced last October 5nm process to obtain an order, some customers began to stream, then thought to be bragging, now look at the 5nm process is indeed catching up.
Samsung is currently the second largest fab in the world, but compared with TSMC’s share of more than 50%, Samsung’s share is about 20%, and in the advanced process progress is significantly behind TSMC, not to mention the previous 28nm to 10nm process, 7nm node alone is more than a year late, From 2018 to 2019, 7nm contract orders were largely taken by TSMC.
Samsung, which has aspired to be the world’s largest fab in recent years, has announced a $116 billion investment plan to surpass TSMC as the first by 2030.
After the 5nm node Samsung began to catch up with TSMC in progress, the 3nm GAA process scheduled for next year’s mass production is even more important, if Samsung is the first to deal with the production of the next generation of transistor technology, then 3nm process may be fully ahead of TSMC.