Media reported that Samsung has begun mass production of its new V1 wafer factory, becoming the first pure ultraviolet lithography (EUV) production line in the industry to fully use the 6LPP and 7LPP manufacturing processes. As an important driver of Samsung’s next-generation manufacturing process, EUVL reduces multiple exposures and increases the yield of chips with more sophisticated designs.
Initially, Samsung used EUVL devices for its 6LPP and 7LPP nodes, and is expected to expand to process nodes such as 5LPE, 4LPE, 3GAE, and 3GAP in the future.
The plant’s 7LPP and 6LPP processes will be used to deliver high-end mobile SoCs in the first quarter of this year, but the name of the contract customer is not yet known.
It is important to note that 6LPP is not part of the Samsung Multi-Project Wafer (MPW) shuttle program, or indicates that the process applies only to Samsung’s own products (or those who do not apply to MPW).
The 6LPP is the evolution of Samsung’s 7LPP nodes, increasing transistor density and lower power consumption by about 10%, and is compatible with IP originally developed for 7LPP and can be reused.
In addition, 6LPP supports designers eager to invest in new IP and Multi Diffusion Break capabilities.
However, 6LPP may only be limited to some customers, and the future focus appears to be on the new 5PLE node, which offers additional power, performance, and more.
It is reported that Samsung V1 fab located in Huacheng, South Korea, adjacent to the S3, where the company opened the first mass production of 7LPP process chips.
Samsung began construction of the V1 in February 2018 and began testing production of wafers in the second half of 2019. The company will now continue to expand its V1 fab production capacity.
By the end of 2020, the total number of capacity nodes below EUV 7LPP is expected to triple to 2019, and cumulative investment in V1 will reach $6 billion.