Modular small chip design gives AMD huge cost-cutting space

During the 2020 International Solid State Circuitconference (ISSCC) keynote presentation earlier this month, AMD described the significant financial benefits it has achieved through its multi-chip modularization (MCM) approach. As TechPowerUp emphasized, the company has been able to achieve significant cost savings by using the cutting-edge 7nm process for the manufacture of the CPU core while applying the inclusive process to other modules such as I/O control chips.

Modular small chip design gives AMD huge cost-cutting space

As seen from the slides released by AMD, a hypothetical, 3rd Generation Ryzen processor with 16 cores built entirely in a 7nm process comes at a cost more than twice as much as a modular i/O modular split manufacturing solution.

In addition, Guru3D provides another reliable argument for AMD’s carefulchip design philosophy. Because when making larger molds, the likelihood of a decline in yield is also remarkable.

In order to achieve a better balance between yield and cost-effectiveness, AMD’s Multi-Chip Module solution is clearly preferable to stay ahead of the competition.

For end-consumers, this will also enable us to price our products more competitively. So in the years after the birth of Ryalong, the dreary PC market also rarely appeared a wave of shouts “AMD, YES!” “The wave.