Huawei Mate 30 Pro 5G Discovery: Self-researchIng Hythe chip accounts for half

On November 1st, the 5G version of Huawei’s Mate 30 series was officially launched, with a seven-minute sales record of 700 million. TechInsights, a professional chip research organization, also got a Mate 30 Pro 5G (LIO-AN00) for the first time, and carried out professional dismantling and analysis, accidentally found from Huawei hisilicon self-made chip, the proportion has actually reached half.

Front side chips (left to right):

华为Mate 30 Pro 5G探秘:自研海思芯片占一半

– Heath Hi6421 Power Management IC

– Heath Hi6422 Power Management IC

– Heath Hi6422 Power Management IC

– Heath Hi6422 Power Management IC

– NXP PN80T Secure NFC Module

– ST BWL68 wireless charging receiver IC

– Guangdong halo Microelectronics HL1506 Battery Management IC

The back side chips (left to right):

华为Mate 30 Pro 5G探秘:自研海思芯片占一半

– Guangdong halo Microelectronics HL1506 Battery Management IC

– Hess Hi6405 Audio Codec

– STMP03 (identity unknown)

– Silicon Mitus SM3010 Power Management IC (Suspected)

– Cirrus Logic CS35L36A Audio Amplifier

– MediaTek MT6303 Tracker IC

– Heath Hi656211 Power Management IC

– Heath Hi6H11 LNA/RF Switch

– Murada Front-end Module, Japan

– Hisilicon Hi6D22 front-end module

– Hisilicon Kirin 990 5G SoC processor and SK Hynix 8GB LPDDR4X memory (PoP integrated package)

– Samsung 256GB Flash

– Texas Instruments TS5MP646 MIPI Switch

– Texas Instruments TS5MP646 MIPI Switch

– Hisilicon Hi1103 Wi-Fi/Bluetooth/Location Navigation Wireless IC

– Hisilicon Hi6H12 LNA/RF Switch

– Hisilicon Hi6H12 LNA/RF Switch

– U.S. cirrus Logic Logic CS35L36A Audio Amplifier

– Hisilicon Hi6D03 MB/HB Power Amplifier Module

Another subplate (left to right):

华为Mate 30 Pro 5G探秘:自研海思芯片占一半

– Hisilicon Hi6365 RF Transceiver

– 429 power amplifier from unknown manufacturer (suspected)

– Hisilicon Hi6H12 LNA/RF Switch

– Qualcomm QDM2305 front-end module

– Hisilicon Hi6H11 LNA/RF Switch

– Hisilicon Hi6H12 LNA/RF Switch

– Hisilicon Hi6D05 Power Amplifier Module

– Murata Front-end Module, Japan

– 429 power amplifier from unknown manufacturer (suspected)

The Mate 30 Pro 5G uses a total of 36 chips (SoC processors and memory calculations), of which Huawei Hisilicon owns 18, accounting for half (some of the chips are reusable, of course).

There are also two Guangdong halo microelectronics battery management IC, and even if the three unknown sources of chips are foreign, the proportion of domestic chips also reached 56%.

Considering the complexity of the supply of smartphone components, it is almost impossible to do 100 per cent self-research or even 100 per cent domestic, but with the proportion of self-research, domestic chips is getting higher and higher, autonomy will certainly be higher and higher.

Also you may notice, there is also a chip from Qualcomm, the QDM2305 front-end module, in the Mate 30 Pro 5G.

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