AMD today unveiled the Zen CPU Architecture Roadmap, RDNA/CDNA GPU Architecture Roadmap, which is a feast for A rice and technology enthusiasts, but also unexpected changes in the manufacturing process. Prior to this, the AMD Zen architecture roadmap, Zen 3 has been labeled as “7nm plus”, while TSMC, 7nm process is divided into three versions, one is the first generation of the use of DUV technology N7, the second generation is still using DUV technology N7P, three is the first introduction of EUV ultraviolet lithography N7 plus, such as Huawei Kirin 990 5G is n7 plus.
Roadmap announced at CES 2018
Road map for July 2019
As a result, everyone agrees that AMD’s so-called 7nm plus is TSMC’s N7 plus 7nm EUV, but on the latest road map, both Zen 3 and RDNA 2 are changed to 7nm, the plus sign at the back is gone, and the Zen 4 will go straight to 5nm.
Does this mean that the Zen 3, RDNA 2 process shrinks and returns to the first generation 7nm? Or am AMD not interested in EUV technology?
In response, AMD explained to the media that the 7nm plus change to 7nm on the roadmap was to avoid misunderstandings, and that the next generation of 7nm process products may use an enhanced version of the process to provide the best high-performance library to the target market.
In other words, AMD still doesn’t know which version of the 7nm process Zen 3 and RDNA 2 will use, and can only say that the N7P Enhanced Version is the most likely.
As for why to skip 7nm EUV and go straight to 5nm, it is likely that AMD believes that the first-time eUV technology in terms of yield, performance, cost and other aspects of comprehensive consideration is not the best choice, in fact Qualcomm, Apple and so on are not too interested in EUV.
Of course, this does not mean that AMD completely rejects the EUV, once matured, which is conducive to improving performance and reducing costs, no one will completely reject it.