Intel’s 10nm production in semiconductor processes may be an important sign that it will not be as productive as 22nm and 14nm. Previously, the industry has repeatedly reported that Intel will also outsource chips to TSMC, the latest news that in 2022 Intel will also come to power 3nm.
Intel is expected to use TSMC’s 6nmn process on a large scale in 2021 and is currently making a mask, according to industry sources.
Intel will further use TSMC’s 3nm process in 2022.
In an earlier revelation, the phone chipmaker pointed out that Intel began outsourcing mainly GPUs and chipsets in 2021, and warned that Apple, Heath, Intel and AMD would be very tight in 2021.
If Intel really wants to expand outsourcing, in addition to the chipsets that have already been partially outsourced, the first to be the GPU, because the GPU is simpler than CPU manufacturing, and TSMC has a lot of experience in GPU manufacturing.
Combined with the previous information, Intel’s Xe architecture unique DG1 is manufactured using its own 10nm process, launched at the end of this year, with 96 sets of EU execution units, a total of 768 core, the base frequency of 1GHz, acceleration frequency 1.5GHz, 1MB secondary cache and 3GB of memory, TDP is 25W.
The dG1 is expected to perform on a similar scale to the GTX950, about 15% worse than the GTX 1050, and its overall positioning is not high enough to be suitable for energy-efficient areas, especially notebook GPUs.
DG1 will be followed by DG2 unique, this is a high-performance CPU, before the explosion dG2 will use the 7nm process of the on-stage building power, now look swhat should be 7nm modified version of the 6nm process.
But Intel’s own 7nm process will also be mass-produced in 2021, and officials have already announced that the Ponte Vecchio acceleration card for data centers will use its own 7nm EUV process.